1.5mm/2.0mm/2.5mm/3.0mm/3.5mm Solder Wire with Suction Belt BGA Solder Pad Removal Tool

Features:

Refined with 99.9% pure copper and special chemicals to ensure good, fast and economical use.

It can absorb excess solder when removing tin. It is resistant to oxidation and corrosion. It has good thermal conductivity and tin loading effect. It can absorb tin cleanly.

 

Specification:

Size: 1.5 / 2.0 / 2.5 / 3.0 / 3.5mm

Tin content: 60%

Melting point: 183 °C

 

Package included:

1 x Solder Wire

 

Details pictures: