BEST BST-705 Solder Paste 50g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux

BEST BST-705 Solder Paste 50g Strong Adhesive Lead Free Silver With Silver Tin Soldering Flux

  • R 286.45
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Description :

BEST-solder (Tin) paste is the best choice of reballing IC 
original BEST brand 
Quality Verified                          
Application: can be used for laptop /computer/mobile phone/home Appliances SMD IC and BGA IC repairing ,tools for chip-levelrepairing and  Electronics Manufacture line. 
 
Specification :

ModelBEST-705 
Alloy composition:Tin:99% / silver: 0.3% / copper:0.7% 
Melting point :226-229 °C
Tin powder particle size:25-45/μm
Tin powder shapes: spherical
Metal content:89.5 ± 1%
Refrigeration temperature:5 ~ 10 °C
N.W.:50g/pc
 
Package Includes :

1 x BEST BET-750 Solder Paste
 
Details Pictures :