Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering
Tax included.
Features:
Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 7, 7P.
Function: Repairing or fixing problem of iphone 7 7P processor.
Package includes:
1 x BGA Reballing Stencils for iPhone 7/7P
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