KAISI 3D IC Chip BGA Reballing Stencil Kits A8 A9 A10 A11 A12 Stencil Tin Planting Net Hand Tools for iPhone 6/6 Plus 6S/6S Plus 7/7 Plus 8/X XS/XR

Features:

 

This 3D BGA reball stencils can location the IC chip when you repair, it's so convenient, stable and accurately.
No need IC holder station.

Type: 

A: A8: Suitable for iPhone 6/6 plus 

B: A9: Suitable for iPhone 6S/6S Plus

C: A10: Suitable for iPhone 7/7 plus

D: A11: Suitable for iPhone 8/X

E: A12: Suitable for iPhone XS/XR

 

Notice:

 

1.The package don't include any IC.

2. Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same. 

Package Included: 

 

1x A8/A9/A10/A11 Set 3D BGA Reball Stencils

Detail Pictures: