SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Pulp

Features:

High density, high impedance

Pure alloy compositin

Fine and sticky

Stannum planting, not bubbing

Silver containing highlight

 

Model: SP-X

Weight: 50g

Size: 38 x 31 x 35mm

Melting Point: 158??/span>

Package Included:

1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
 
Detail Pictures: