MECHANIC Unleaded Solder Paste Fast Welding Cellphone Repairs BGA Main Board NAND CHIP Tin Plant Tin

Features:

A

Lead-free low temperature.

Melting point: 138??/span>

B

Medium temperature

Melting point: 183??/span>

C

Unleaded high temperature

Melting point: 210-227??/span>
 

Package Included:

1 x MECHANIC Unleaded Solder Paste

Detail Pictures: