Qianli S450 3D BGA Reballing Stencil Communication Logic Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P
Tax included.
Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
Specification:
Type: A: for PHone 5/5s B: for PHone 6/6p C: for PHone 6s/6sp D: for PHone 7/7p E: for PHone 8/8p
Type: A: for PHone 5/5s B: for PHone 6/6p C: for PHone 6s/6sp D: for PHone 7/7p E: for PHone 8/8p
Package included:
1 x BGA Reballing Tool
1 x BGA Reballing Tool
Details pictures:
